ホーム > 2021 COMSOL Simulations WEEK > 基調講演・口述講演一覧 > Thermal Stress Analysis of Power Device Structure in Silver Sintered Direct Chip Bonding under Thermal Cycling Test
口述講演
Thermal Stress Analysis of Power Device Structure in Silver Sintered Direct Chip Bonding under Thermal Cycling Test
【Abstract】
This paper presents the results of thermal stress analysis of power device structures during thermal cycling tests of silver sintered direct chip bonding using COMSOL multiphysics. The silver sintered direct chip bonding is a promising technology for high efficiency heat dissipation and high reliability of power devices. In order to evaluate the reliability of this structure, the results of thermal stress analysis and the effect of warpage are discussed.
【Keyword】
Thermal Cycling Test, Direct Chip Bonding, Ag Sintering, Thermal Stress Analysis
【Products】
COMSOL Multiphysics, structural-mechanics Module, nonlinear-structural-materials Module, fatigue Module